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dc.contributor.authorCiofi, Carminees-ES
dc.contributor.authorGiannetti, Romanoes-ES
dc.contributor.authorNeri, Brunoes-ES
dc.date.accessioned2019-09-11T03:59:40Z
dc.date.available2019-09-11T03:59:40Z
dc.date.issued01/06/1998es_ES
dc.identifier.urihttp://hdl.handle.net/11531/40680
dc.descriptionCapítulos en libroses_ES
dc.description.abstractes-ES
dc.description.abstractThe design and principle of operation of a measurement system primarily intended for performing MTF (median time to failure) tests on metallic interconnections of integrated circuit is presented. The instrument is different from other similar equipment in that a separate heating system is used for each sample. This approach will allow one, probably for the first time, to perform such tests in the ideal conditions of constant current and temperature for all the samples.en-GB
dc.format.mimetypeapplication/pdfes_ES
dc.language.isoen-GBes_ES
dc.publisherSin editorial (Saint Paul, Estados Unidos de América)es_ES
dc.rightses_ES
dc.rights.uries_ES
dc.sourceLibro: 15th IEEE Instrumentation and Measurement Technology Conference - IMTC 1998, Página inicial: 1282-1285, Página final:es_ES
dc.subject.otherInstituto de Investigación Tecnológica (IIT)es_ES
dc.titleTemperature controlled multi-oven for MTF testses_ES
dc.typeinfo:eu-repo/semantics/bookPartes_ES
dc.description.versioninfo:eu-repo/semantics/publishedVersiones_ES
dc.rights.accessRightsinfo:eu-repo/semantics/restrictedAccesses_ES
dc.keywordses-ES
dc.keywordsTemperature control, Circuit testing, Performance evaluation, Time measurement, Integrated circuit measurements, Integrated circuit testing, System testing, Integrated circuit interconnections, Instruments, Heatingen-GB


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