True constant temperature measurement system for lifetime tests of metallic interconnections of IC's
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Date
01/10/1998Estado
info:eu-repo/semantics/publishedVersionMetadata
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True constant temperature measurement system for lifetime tests of metallic interconnections of IC's
Tipo de Actividad
Artículos en revistasISSN
0018-9456Materias/ categorías / ODS
Instituto de Investigación Tecnológica (IIT)Palabras Clave
Electromigration, metallization, microcomputers, reliability testing, temperature control.