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Temperature controlled multi-oven for MTF tests

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IIT-98-088A.pdf (483.9Kb)
Date
01/06/1998
Author
Ciofi, Carmine
Giannetti, Romano
Neri, Bruno
Estado
info:eu-repo/semantics/publishedVersion
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Abstract
 
 
The design and principle of operation of a measurement system primarily intended for performing MTF (median time to failure) tests on metallic interconnections of integrated circuit is presented. The instrument is different from other similar equipment in that a separate heating system is used for each sample. This approach will allow one, probably for the first time, to perform such tests in the ideal conditions of constant current and temperature for all the samples.
 
URI
http://hdl.handle.net/11531/40680
Temperature controlled multi-oven for MTF tests
Tipo de Actividad
Capítulos en libros
Materias/ categorías / ODS
Instituto de Investigación Tecnológica (IIT)
Palabras Clave

Temperature control, Circuit testing, Performance evaluation, Time measurement, Integrated circuit measurements, Integrated circuit testing, System testing, Integrated circuit interconnections, Instruments, Heating
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